FT2400 'Nexus' Madrona Motherboard Layout

Front & Rear Views

Font View

Rear View

Motherboard

Processor Upgrade

In a symmetric multiprocessor (SMP) environment all processors are equal and have no preassigned tasks. Distributing the processing loads between both processors increases system performance. This is particularly useful when application demand is low and the I/O request load is high. In an SMP environment, both processors share a common bus, the same interrupt structure, and access to common memory and I/O channels. The SMP implementation conforms to the Multiprocessor Specification Version 1.4.

If the supplied system is fitted with only a single processor, a second processor and DC converter (VRM) may be fitted. The second processor must be identical to the one already installed. The second processor slot, if unused must have a termination board fitted.

Removing the Termination Board

Do not remove this board unless you are adding a second processor.

1. Remove the left side cover.
2. Press the latches on the Terminator Latching Assembly (TLA) inward.
3. Pull the TLA out of the module retention bracket.
4. Holding the terminator board by its top edge, carefully rock it back and forth until the edge connector pulls free.

Installing a Voltage Regulator Module

1. Remove the left side cover.
2. Being careful not to touch the components or connector on the voltage regulator module, remove it from its protective wrapper and place it on a nonconductive, static-free surface.
3. Record the module ID information (may be a date code) in your equipment log.
4. Hold the module by its top edge or upper corners and firmly press it into the connector on the system board until the lock tabs click into place.

Installing a second Pentium II Processor

1. Remove the left side cover.
2. Remove the termination board as previously described.
3. Fit the VRM as previously described.
4. Being careful not to touch the components or gold edge connectors on the processor module, remove it from its protective wrapper and place it heat-sink side down on a nonconductive, static-free surface.
5. Record the module serial number in your equipment log.
6. Press the locking tabs inward until they remain retracted.
7. Hold the module by its top edge or upper corners, and firmly press it into the connector on the system board. Press the locking tabs outward so they engage the support bracket.

8. Replace the left side cover.
9. Run the SCU to configure the system.

Memory Module

The SDRAM memory module is a motherboard sub-board which plugs into a slot on the system board as shown in the diagram below:

The SDRAM memory module has four DIMM sockets. This module supports from 16 MB to 512 MB of 3.3V, 66 MHz, unbuffered, 72-bit ECC SDRAM modules. Mixing dissimilar metals may cause failure. Install DIMMs with gold-lead alloy plated edge connectors only in gold-lead alloy plated sockets.

It is recommended that all DIMMs should be of the same size, type and speed. Although it is possible to mix different DIMM sizes, mixes of type and speed can be problematic. Only type and speed mixes which have been positively cleared by Mitsubishi Electric for factory build can be used. The BIOS automatically detects and initialises the memory array.

ECC memory detects and corrects single-bit errors from DRAM in real time, allowing your system to function normally. It detects all double-bit errors but does not correct them; it also detects all three-bit and four-bit adjacent errors in a DRAM nibble but does not correct them. When one of these multiple-bit errors occurs, the PAC generates an SERR (system error) that usually halts the system. ECC is calculated on a 64-bit wide memory basis.

To avoid potential memory problems, use only DIMMs from JEDEC-compatible manufacturers that have been tested for compatibility with the memory module. Contact your sales representative or dealer for a list of approved DIMMs.

Sample DIMM Size Combinations - SDRAM module

Front Panel Board

Hot-docking Backplane

The chassis contains provision for 2 off 5 slot hot-docking backplanes.

The hot-docking backplane provides the following:

• Five SCA connectors for SCA-compatible SCSI drives
• Power control for each drive, including automatic slot power down upon removing a drive
• Signal for a fault indicaton (LED) on the front panel for each drive
• Internal I²C bus
• +12 V connector for a fan with tachometer
• Local I²C-based temperature sensor

The SCSI hot-docking backplane provides control signals and power for five wide/fast SCA SCSI III hard disk drives. The backplane receives control signals from the Symbios SCSI controller on the system board through a cable connected to the wide SCSI connector on the backplane. It gets power from the power system through 4-conductor cables connected to the two power connectors.

The SCSI hard disk drives in the hot-docking bay get their control signals and power from the SCA connectors on the hot-docking backplane.

The fault indicators (LEDs) on the front panel indicate failure status for each drive in the hot-docking bay. These indicators get their signals through a cable connected to the front panel connector on the hot-docking backplane.

The temperature sensor on the backplane provides temperature information to other devices in the server through enclosure service messages.

The backplane power control provides powering down of a drive when a failure is detected and reported to the SCSI bus through enclosure service messages. When a new drive is inserted in the hot-docking SCA connector, the power control waits a short time for the drive to become fully seated and then applies power to the drive.

Configuration Options

The hot-docking backplane contains only one configuration jumper: J8, the internal/external jumper.

Internal/External (INT/EXT) Jumper J8

When this jumper is in the "INT" position, jumper on pins 1 and 2, (default setting) the backplane assumes it is operating in an "internal" peripheral bay in the server chassis.

When this jumper is in the "EXT" position, jumper on pins 2 and 3, the backplane assumes it is operating in an "external" peripheral bay in a peripheral expansion chassis. This option is not currently available with this computer and must not be selected.

SCSI ID Configuration Options

The SCSI chip on the hot-docking backplane uses the SAF-TE protocol to communicate with the system board. This chip uses SCSI ID 6; therefore, other SCSI devices cannot use this address.

* Jumper default setting.

Power Distribution

Power Share Backplane

The power share backplane distributes the power load of the server among two or three power supplies. The backplane is mounted on two snap-on stand-offs and six threaded stand-offs on the centre wall inside the chassis.

Warning
Hazardous voltage, current, and energy levels are present inside the power share backplane. There are no user serviceable parts inside it; servicing should only be done by technically qualified personnel.

Power System Configurations

The server contaions a modular power system that may be configured with one, two, or three 360 Watt power supplies.

An entry level power system typically limits the server configuration to dual processors, 1 GB memory, five hard drives, and total power dissipated. A maximum level power system provides power for fully configured servers.

Each power supply has a built-in fan and its own power cord. For servers with redundant power systems, the loss of a single power supply will not affect the operation of the server.

Drives & Add-Ins

Hard Drives
MB	Make	Model	Type	Part Number
4.5GB	Quantum	HN4550J 'Atlas II'	UltraSCSI	HB58476
9GB	IBM	DDRS-39130 'Draco'	UltraSCSI	XB62206
Tape Drive
MB	Make	Model	Type	Part Number
12-24GB	HP	HP C1537A	DDS III	SU61220
72-144GB	HP	HP C1557A Autoloader	DDS III	SU61226
Floppy Drives
MB	Type	Part Number
2 MB	3.5"	16284630
CD-ROM
Speed	Type	Part Number
16x	IDE	16285530

Add-ins

DIMM memory expansion
32MB upgrade (1 x 32MB SDRAM DIMM)	XB62607
64MB upgrade (1 x 64MB SDRAM DIMM)	XB62608
128MB upgrade (1 x 128MB SDRAM DIMM)	XB62609
Additional Processors
Single to dual Pentium II at 300MHz, 512KByte Cache	XB62828
Redundant Power Supply
N+1 Redundant power supply upgrade (includes 1 PSU modules)	XB6000
Additional hot swap power supply module for the above	XB62296
Network options
3Com 10/100 PCI Ethernet card (3C905TX)	XB59527
3Com PCI Ethernet Combo card (3C900)	XB59526
Intel Pro 100B PCI Ethernet Card	XB61343
Rack Mount Kit
Rack mount assembly for mounting server in 19" rack	XB61584
Controller cards
2nd backplane for additional U/W SCSI channel	XB62320
RAID
AMI 434 2 channel RAID (requires 2nd backplane for dual channel)	XB6001
4MB AMI RAID Cache Upgrade	XB61650
Server Management
Server Management Card	XB61339
Modem for the above (PCMCIA)	XB61341
UPS
APC 1000v/a Smart UPS	XB60370

Jumper Settings

CMOS

The jumper on the J2J1, CMOS PROT pins preserves the CMOS settings during system reset. Moving the jumper to the CLR pins clears CMOS and sets it and the real-time clock (RTC) to the manufacturing default settings during system reset.

To reset the system’s CMOS and the RTC to factory default values:

1. Remove the left side cover.
2. Move the jumper on the J2J1, CMOS PROT pins to the CLR pins.
3. Replace the left side cover, and connect the power cord(s) to the system.
4. Turn the system on, and wait for POST to complete. This automatically reprograms CMOS and RTC to their default settings.
5. Turn the system off, disconnect the power cord(s) from the system, and remove the left side cover.
6. Move the jumper on the J2J1, CMOS CLR pins to the PROT pins.
7. Replace the left side cover, and connect the power cord(s) to the system.
8. Run the SCU to configure your system.

Back-up Battery

The lithium battery on the system board powers the real-time clock (RTC) for up to 10 years in the absence of power. The RTC contains 256 bytes of general purpose RAM that stores the system BIOS configuration information, clock registers, and general purpose control registers. When the battery starts to weaken, it loses voltage, and the system settings stored in CMOS RAM in the RTC (for example, the date and time) may be wrong.

Replacing the Back-up Battery

1. Remove the left side cover.
2. Locate the battery from the diagram of the motherboard, where it is identified as ‘FF’.
3. Insert the tip of a small plastic tool, or equivalent, under the plastic tab on the snap-on plastic retainer. Gently lift up and pull back on the retainer to remove it from the lithium battery socket.

Warning
Do not use a metal or other conductive implement to remove the battery. If a short-circuit is accidentally made between its positive and negative terminals, it may cause the battery to explode.

4. Remove the battery from its socket.
5. Dispose of the old lithium battery according to the battery manufacter’s instructions.
6. Remove the new lithium battery from its package, and, being careful to observe the correct polarity, insert it into the battery socket.
7. Install the snap-on plastic retainer on the socket and make sure it holds the battery firmly.
8. Replace the left side cover.
9. Run the SCU to restore the configuration settings to the RTC.

System Resources

I/O Map

The I/O map in the following table shows the location in I/O space of all directly I/O accessible registers.

* SCSI I/O base address is set using the configuration registers.

 

Interrupts

The following table shows the logical interrupt mapping of interrupt sources on the system board.

POST Beep Codes

POST cannot display messages when an error occurs before the video display is initialised. Instead, it emits one long and two short beeps. Other beep codes are a series of individual beeps, each one equal in length. Write down the beep code you hear, plus any error messages that appear; this information will assist in fault diagnosis.